The Joints Are Made With Two Types Of Adhesives Respectively, one Phenolic Resin With Higher Elastic Modulus And The Other Acrylic Adhesive With Lower Elastic Modulus.
Keywords: A kind of technology of solder of glue of of Numerical Analysis of of Stress Distribution of of Weldbonding Weld Spot Diameter is resistor spot welding and union of photograph of adhesive join technology novel, efficient compound join method  . Glue solder structure shoulders adscititious load jointly by solder dot and adhesive layer, its are mechanical performance is more superior than structure of simple resistor spot welding or adhesive bonding structure much. Already test result makes clear, glue solder structure not only intensity (below fatigue load and dead load) tall, it is good to fight ageing endurance, weight is light, and have good acoustics damp character [2 ～ 4] , already made a domain win wider application in aviation, spaceflight and car. Russia is before in the production of conveyor, helicopter used glue solder technology; A kind of type of production of the United States used the structure of glue solder frame of 5% on helicopter, a lot of shares that lid of the airframe of a kind of transport, mouth, gasoline tank and a kind of new-style low altitude boost battleplan used glue solder technology; Japan already was produced gave sedan of connective of complete glue solder. The quality of glue solder structure is included the effect of a lot of element such as material, craft, appear as a result of glue solder craft later, up to now, receive the effect of head function to glue solder about each parameter, the research that has still is an abecedarian. Of glue solder connect rupture mechanism, rupture criterion has not been built far, restricted glue solder craft to be in greatly consequently great bear the weight of the application in the component. Already some a few research, use what experiment method inspected glue solder connect to rupture type and the relation of its and each parameter, but the numeric analysis job of glue solder connect still reports rarely. Wait for an element to receive the effect of a mechanical function to glue solder to analyse parameter of material function, geometry well and truly, efficiently, with numeric analysis the method analyses the influence pattern that the stress in heads of these element butt joint distributings, mix to reasonable select material optimize joint design, and contact ruptures mechanism analysis and connect rupture of criterion build, have very important sense. The measure that the solder in glue solder structure orders is met by finishing craft, solder the influence of craft parameter place such as pressure of electric current and voltage, electrode. The metropolis such as change of pH indicator of medium of the network voltage wave motion in glue solder process, finishing makes solder nods size happening to change. In regarding glue solder as contact important bear the weight of part, the carrying capacity that solder nods has main effect. What the article narrates is to use play plasticity finite yuan of analysis method, the stress in the glue solder contact that numeric analysis has different solder to burn volume distributings. 1 computation model and connect of solder of material function glue are used commonly build receive a form, the assess of mechanical function also uses glue solder contact normally sheet takes test specimen. The article chooses the glue solder sheet that the graph shows 1 times to build test specimen to undertake an analysis. Test specimen two end bear even drawing cuts load. Because this test specimen is X axial symmetry, undertake an analysis to on its half part only so. Graph 1 glue solder builds the form that receives test specimen and dimension Fig.
Of test specimen of of 1 Shape And Dimension Of Weldbonded Specimen finite yuan reseau differentiates if the circumstance pursues 2 are shown. Use three-dimensional 8 node brick is unit, on, below board it is two each minutes with adhesive, near overlap brim and solder drop edge area reseau fractionize, the smallest size 0.
15 Mm. (The whole of A) test specimen is finite yuan of reseau (what B) solder orders a share is finite yuan of reseau graph of 2 test specimen finite yuan reseau differentiates Fig.
2 take no account of the influence of electrode impress in analysis of of Finite Element Mesh Pision Of The Specimen; Assume structural join is in good condition, on combinative scale nonexistent blemish; Because scope of hot influence area is little, and function and solder nucleus area are adjacent, reason assumes nucleus of the solder in contact, heat affects an area to have same mechanical function. The mechanical function rank that data uses in computation is expressed 1. Mother capable person is 08A1 armor plate, inspected the adhesive that two kinds of different and stretch models measure, namely the glue solder connect of the acrylic ester adhesive of the adhesive of phenolic aldehyde colophony that high stretch standard measures and quantity of low stretch standard. Use what curve of bilinear stress meet an emergency depicts material to play - plasticity function, gave out the sclerotic model of material measures Et. Use Algor to play plasticity finite yuan of analysis program, p=5 carries outside was being calculated.
The stress in the connect below 4 KN distributings. Assume contact is in small be out of shape condition, data considered in the analysis nonlinear, take no account of geometry nonlinear. Computation is finished on computer of IBM Pentium 166. Express 1 finite yuan of mechanical function <DIV Align=center that data uses in the analysis>Poisson of E/MPa of quantity of material flexibility model succumbs than υ Et/MPa of quantity of sclerotic model of intensity σ Y/MPa cuts a model to measure 190 000 0 of G/GPa mother capable person.
251602 000 76.
00 solder nod 200 0000.
2 8750 of glue of colophony of 34 phenolic aldehyde.
Glue of 06 acrylic ester 500.
72E-2</DIV>2 computation result and discussion Von_Mises succumb criterion thinks, the effective stress of some bit between high above in the sky obtains data succumb when intensity, begin at this o'clock to enter plasticity state. Eff of effective stress σ defines the Eff2= that it is σ [(σ X - σ Y) 2 ＋ (σ Y - σ Z) 2 ＋ (σ Z - σ X) 2 ＋ 6 (Zx2 of τ of ＋ of Yz2 of τ of τ Xy2 ＋ ) ] / : σ X, σ Y, σ Z is in for some bit respectively X, on Y and Z direction stress; τ Xy, τ Yz, 3 independent shearing stress that τ Zx nods for some heft. Effective stress is to study metallic stuff to plasticity is out of shape and rupture one of main and mechanical parameter of mechanism, commonly used and effective stress will describe stress condition of the structure, the invalidation that serves as a structure decides parameter. The article basically gave out the influence rule that solder dot diameter distributings to Eff of effective stress σ . 2.
Adhesive of colophony of 1 phenolic aldehyde the stress of glue solder connect distributings graph 3, 4 gave out glue solder sheet builds adhesive of phenolic aldehyde colophony the stress in contact, solder nods diametical D=5, 6, 7, 8, 9 with 10 Mm. Graph 3 it is upper part board (graph 1 in) on the central line that combines interfacial X direction with adhesive (express) with the abscissa, stress is building those who receive length direction to go up to distributing; Graph the 4 curves that nod the stress on right predestined relationship and overlap right predestined relationship to nod a diameter to change along with solder for the solder on afore-mentioned interfaces. Graph internal stress of overlap of connect of solder of glue of colophony of 3 phenolic aldehyde the distributinging Fig of direction of edge board length.
3 Stress Distribution Of Phenolic Resin Weldbonded Joints Along The Plate Length Direction In Overlap Region pursues the relation Fig of dot of solder of connect of solder of glue of colophony of 4 phenolic aldehyde and overlap brim stress and solder dot diameter.
of 4 Dependence Of The Stresses At Edges Of The Weld Spot And The Overlap Region Of Phenolic Resin Weldbonded Joints On The Weld Spot Diameter by the graph 3 knowable, distributinging trend of the stress in the overlap of glue solder connect of the diameter of 6 solder dot that inspects is basic and same. The right brim that in each connect solder nods (X=2.
5 ～ 5 Mm) and overlap control stress of peak of existence of both sides predestined relationship, prep above of stress of overlap right predestined relationship the stress of its left predestined relationship; Solder nods the stress of interior of sub of in-house stress prep above, solder nods in-house stress to distributing even. The glue solder connect with different diameter of dot of 6 kinds of solder, stress of overlap brim peak stress of peak of edge of drop of prep above solder, area is tall stress area near knowable overlap brim. Nod diametical addition as solder, sub and the stress with solder in-house dot did not change basically. The stress of solder drop edge nods diametical accretion along with solder and increase, the peak stress of overlap brim does not order diametical change basically along with solder and change. From the graph 4 can more see this clearly, when solder nods diametical D to increase 10 Mm from 5 Mm, the stress of overlap brim is basic and changeless, solder nods the stress of right predestined relationship to increase gradually, span is 25 MPa about. Already some is finite yuan the analysis makes clear as a result, effective stress is in adhesive of phenolic aldehyde colophony on the overlap brim of glue solder connect whole board wide inside distributing equably. Calculate from above the result is knowable, as solder dot diameter increases, the effective stress on overlap brim is basic and changeless. The glue solder connect that nods a diameter to 6 kinds of studies solder, the stress that overlap brim manages the stress that edge of mid solder drop manages prep above board. Try fact of test and verify, take contact to using the glue solder sheet of adhesive of structure of phenolic aldehyde colophony, contact ruptures much with board tear off (Adherend_tearing) form  appear, rupture to be in from overlap brim namely board inside the predestined relationship begins to happen, continue when to load, crackle is perpendicular at outside carry direction to be in board inside patulous. This is one of basic forms that glue solder connect ruptures. This computational earnings result can add up to manage explanation afore-mentioned phenomena. Nod diametical addition as solder, although solder nods brim stress to increase somewhat, but overlap brim stress is basic and changeless, and overlap brim stress still prep above solder nods brim stress, so, increase the diameter that solder nods, fatigue to glue solder connect intensity and rupture the form won't produce apparent effect. 2.
Adhesive of 2 acrylic ester the stress of glue solder connect distributings graph 5, 6 gave out glue solder sheet builds acrylic ester adhesive the stress in contact, solder nods diametical D=5, 6, 7, 8, 9 with 10 Mm. Graph 5 it is upper part board (graph 1 in) on the central line that combines interfacial X direction with adhesive (express) with the abscissa, stress is building those who receive length direction to go up to distributing; Graph the 6 curves that nod the stress on right predestined relationship and overlap right predestined relationship to nod a diameter to change along with solder for the solder on the interface. Graph internal stress of overlap of connect of solder of glue of 5 acrylic ester the distributinging Fig of direction of edge board length.
5 Stress Distribution Of Acrylic Adhesive Weldbonded Joints Along The Plate Length Direction In Overlap Region pursues the relation Fig of dot of solder of connect of solder of glue of 6 acrylic ester and overlap brim stress and solder dot diameter.
of 6 Dependence Of The Stresses At Edges Of The Weld Spot And The Overlap Region Of Acrylic Adhesive Weldbonded Joints On The Weld Spot Diameter by the graph 5 visible, the glue solder of diameter of dot of 6 kinds of solder the stress in lap joint overlap distributings the trend is basic and same. The stress with solder in-house dot is apparent stress of interior of prep above sub. Area is put in overt tall stress value near solder drop edge, the stress of sub interior is basic and even, inside the sub around overlap right predestined relationship, stress shows ascendant trend. Overlap right is the highest stress in sub along the stress of place, but the stress that orders brim part under solder far. Reason at this moment area is the highest stress area inside overlap near solder drop edge. Nod diametical accretion as solder, solder nods right to be reduced along the stress of place, the stress cost that overlap right predestined relationship manages is basic and fixed. From the graph 6 can see clearly, when solder nods diametical D to increase 10 Mm from 5 Mm, the stress of overlap brim is basic and changeless, the stress of predestined relationship of solder dot right is reduced make an appointment with 25 MPa. This alleviated on certain level the stress concentration of solder drop edge. Finite yuan the analysis makes clear, differ with the glue solder connect of adhesive of phenolic aldehyde colophony, in acrylic ester adhesive glue solders in the head, the effective stress of overlap brim shows the distributinging trend with the tall, low margin intermediate. Right now board the stress that the brim manages is worth under board mid, visible, acrylic ester adhesive glue solder connect basically shoulders load by solder dot. Below outer load action, contact is cracked since place of solder drop edge first, the dot that it is solder is torn off model (Nugget Through) ruptures means  . Be in identical outside below load condition, the stress that solder drop edge manages nods the addition of dimension along with solder and reduce, the stress of overlap brim is basic and changeless. Visible, nod diametical accretion as solder, the inhomogenous degree that the stress in overlap distributings is reduced somewhat, accordingly, increase solder to nod a diameter to be able to increase the carrying capacity of contact. The connect of acrylic ester adhesive of diameter of studies dot of 6 kinds of solder, solder nods brim stress to always be more than overlap brim stress, reason solder nods what diametical change won't change contact to rupture means. 3 conclusion are used three-dimensional play plasticity finite yuan of method, studied glue solder sheet builds phenolic aldehyde colophony and acrylic ester adhesive the influence that the stress in head of butt joint of diameter of dot of the solder in contact distributings, get the preliminary verdict that be as follows: (Stress of edge of drop of solder of prep above of value of stress of brim of overlap of glue solder connect is worth adhesive of colophony of 1) phenolic aldehyde. In pull cut load action to fall, contact is cracked since overlap brim. (When 2) solder nods a diameter to increase, the peak stress of place of edge of drop of the solder in glue solder connect increases adhesive of phenolic aldehyde colophony, and the peak stress of overlap brim is basic and changeless. The strength that increases solder to nod diametical butt joint and rupture the form does not have an influence. (Adhesive of 3) acrylic ester internal stress of overlap of glue solder connect basically distributings to select area in solder. Solder nods stress of brim of overlap of brim stress outclass. In pull cut load action to fall, contact nods edge genesis to crack from solder. (When 4) solder nods a diameter to increase, glue solder sheet builds acrylic ester adhesive stress of peak of edge of drop of the solder in contact is reduced, overlap brim stress is basic and changeless. The inhomogenous sex that the stress in overlap distributings is reduced, advantageous to increasing contact strength, but of contact rupture the form won't produce a change. CNC Milling